Lokesh Siddhu
VIDWAN ID: 628426

Dr Lokesh Siddhu

Male
Assistant Professor | Department of Computer Science and Engineering
Indian Institute of Technology, Guwahati
Expertise: Computer Science Interdisciplinary SCI
11 Publications
0 Projects
99 Scopus Citations
76 CrossRef
1 Year 4 Months Total Experience
Publications
11 Total
Articles
6
Proceedings
5
Activity

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Scopus Scopus
99 Citations
6 h-index
CrossRef CrossRef
76 Citations
5 h-index
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Assistant Professor
May 2025 – Present
Indian Institute of Technology, Guwahati | Department of Computer Science and Engineering
Engineering and Technology
Computer Science Interdisciplinary SCI

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Scholarly Publications

NeuroCool: Dynamic Thermal Management of 3D DRAM for Deep Neural Networks through Customized Prefetching

Open Access
Journal Article
Authors: Shailja Pandey; Lokesh Siddhu; Preeti Ranjan Panda

Dynamic Thermal Management of 3D Memory through Rotating Low Power States and Partial Channel Closure

Open Access
Journal Article
ACM Transactions on Embedded Computing Systems. Year: 2023. Volume: 22 , Issue: 6 .
Authors: Lokesh Siddhu; Aritra Bagchi; Rajesh Kedia; Isaar Ahmad; Shailja Pandey; Preeti Ranjan Panda

CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems

Open Access
Journal Article
ACM Transactions on Architecture and Code Optimization. Year: 2022. Volume: 19 , Issue: 3 .
Authors: Lokesh Siddhu; Rajesh Kedia; Shailja Pandey; Martin Rapp; Anuj Pathania; Jörg Henkel; Preeti Ranjan Panda

CoreMemDTM: Integrated Processor Core and 3D Memory Dynamic Thermal Management for Improved Performance

Conference Paper
Year: 2022. Pages: 1377-1382 .
Authors: Lokesh Siddhu; Rajesh Kedia; Preeti Ranjan Panda

Leakage-Aware Dynamic Thermal Management of 3D Memories

Journal Article
Authors: Lokesh Siddhu; Rajesh Kedia; Preeti Ranjan Panda

Predictncool: Leakage aware thermal management for 3D memories using a lightweight temperature predictor

Conference Paper
ACM Transactions on Embedded Computing Systems. Year: 2019. Volume: 18 , Issue: 5s .
Authors: Lokesh Siddhu; Preeti Ranjan Panda

FastCool: Leakage Aware Dynamic Thermal Management of 3D Memories

Conference Paper
Year: 2019. Pages: 272-275 .
Authors: Lokesh Siddhu; Preeti Ranjan Panda

Operand isolation with reduced overhead for low power datapath design

Conference Paper
Year: 2014. Pages: 483-488 .
Authors: Lokesh Siddhu; Amit Mishra; Virendra Singh
Showing 1 to 8 of 11 publications