Aditya Kumar 
VIDWAN ID: 97570

Prof Aditya Kumar 

Male Doctor of Philosophy
Associate Professor | Department of Chemical Engineering
Indian Institute of Technology (Indian School of Mines), Dhanbad
Jharkhand
Expertise: Chemical Engineering
131 Publications
0 Projects
4025 Scopus Citations
3454 CrossRef
9 Years 1 Month Total Experience
Publications
131 Total
Articles
103
Books
1
Chapters
11
Proceedings
16
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Scopus Scopus
4,025 Citations
38 h-index
CrossRef CrossRef
3,454 Citations
33 h-index
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Personal Details

Doctor of Philosophy
2012
Sri Vyshnavi Degree College, Yemmiganur
Associate Professor
Apr 2021 – Present
Indian Institute of Technology (Indian School of Mines), Dhanbad | Department of Chemical Engineering
Assistant Professor
Aug 2017 – Apr 2021
Indian Institute of Technology (Indian School of Mines), Dhanbad | Department of Chemical Engineering
Engineering and Technology
Chemical Engineering

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Scholarly Work

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A borax-based fire-retardant coating for jute fabric and a process for the preparation thereof

IIT (ISM) Dhanbad
- Application No. : 202531040934 Filed : 28-04-2025
Published : 02-05-2025 Published

A GO-supported Mn2O3 and MoS2 ternary composite for green hydrogen generation and a process for the preparation thereof

IIT (ISM) Dhanbad
- Application No. : 202531006118 Filed : 24-01-2025
Published : 31-01-2025 Published

A transparent anti-dust and corrosion-resistant spray coating for the protection of copper artifacts and a process for the preparation thereof

IIT (ISM) Dhanbad
- Application No. : 202431095100 Filed : 03-12-2024
Published : 13-12-2024 Published

A biodegradable water-repellent PLA coated jute and a process for the preparation thereof

IIT (ISM) Dhanbad
- Application No. : 202431092143 Filed : 26-11-2024
Published : 29-11-2024 Published

A Biodegradable Water-Repellent Coating for Paperboard Packaging Materials and a process for the preparation thereof

IIT (ISM) Dhanbad
- Application No. : 202431069866 Filed : 16-09-2024
Published : 27-09-2024 Published

A water-repellent and biodegradable-polymer enhanced stiff jute-cotton blended (Juco) fabric and a process for the preparation thereof

IIT (ISM) Dhanbad
- Application No. : 202431069395 Filed : 13-09-2024
Published : 27-09-2024 Published

A bio-degradable water-repellent jute for multipurpose applications and a process for the preparation thereof

INDIAN INSTITUTE OF TECHNOLOGY (INDIAN SCHOOL OF MINES)
DHANBAD
- Application No. : 202231066156 Filed : 18-11-2022
Published : 10-02-2023 Published

Scholarly Publications

Thermal modeling and characterization of the Embedded Micro Wafer Level Package (EMWLP) at the package- and system-level

Conference Paper
Year: 2009. Pages: 137-145 .
Authors: Yen Yi Germaine Hoe; Tang Gongyue; Gaurav Sharma; Damaragunath Pinjala; Vempati Srinivasa Rao; Jong Ming Chinq; Sharon Lim Pei Siang; Aditya Kumar; Ho Soon Wee; Zhang Xiaowu; V. Kripesh

Application of piezoresistive stress sensors in ultra thin device handling and characterization

Journal Article
Sensors and Actuators A: Physical. Year: 2009. Volume: 156 , Issue: 1 , Pages: 2-7 .
Authors: Xiaowu Zhang; Aditya Kumar; Q.X. Zhang; Y.Y. Ong; S.W. Ho; C.H. Khong; V. Kripesh; John H. Lau; D.-L. Kwong; V. Sundaram; Rao R. Tummula; Georg Meyer-Berg

A novel method to predict die shift during compression molding in embedded wafer level package

Conference Paper
Year: 2009. Pages: 535-541 .
Authors: Chee Houe Khong; Aditya Kumar; Xiaowu Zhang; Gaurav Sharma; Srinivasa Rao Vempati; Kripesh Vaidyanathan; John Hon-Shing Lau; Dim-Lee Kwong

Study of 15μm pitch solder microbumps for 3D IC integration

Conference Paper
Year: 2009. Pages: 6-10 .
Authors: Aibin Yu; John H. Lau; Soon Wee Ho; Aditya Kumar; Wai Yin Hnin; Da-Quan Yu; Ming Ching Jong; Vaidyanathan Kripesh; Damaruganath Pinjala; Dim-Lee Kwong

Wafer level embedding technology for 3D wafer level embedded package

Conference Paper
Year: 2009. Pages: 1289-1296 .
Authors: Aditya Kumar; Xia Dingwei; Vasarla Nagendra Sekhar; Sharon Lim; Chin Keng; Gaurav Sharma; Vempati Srinivas Rao; Vaidyanathan Kripesh; John H. Lau; Dim-Lee Kwong

Embedded wafer level packages with laterally placed and vertically stacked thin dies

Conference Paper
Year: 2009. Pages: 1537-1543 .
Authors: Gaurav Sharma; Vempati Srinivas Rao; Aditya Kumar; Nandar Su; Lim Ying Ying; Khong Chee Houe; Sharon Lim; Vasarla Nagendra Sekhar; Ranjan Rajoo; Vaidyanathan Kripesh; John H. Lau

Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP)

Conference Paper
Year: 2009. Pages: 508-515 .
Authors: Ying Ying Lim; Srinivasa Rao Vempati; Nandar Su; Xianghua Xiao; Jinchang Zhou; Aditya Kumar; Phyo Phyo Thaw; Gaurav Sharma; Teck Guan Lim; Shiguo Liu; Kripesh Vaidyanathan; John H. Lau

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

Conference Paper
Year: 2009. Pages: 350-354 .
Authors: Aibin Yu; John H. Lau; Soon Wee Ho; Aditya Kumar; Hnin Wai Yin; Jong Ming Ching; Vaidyanathan Kripesh; Damaruganath Pinjala; Scott Chen; Chien-Feng Chan; Chun-Chieh Chao; Chi-Hsin Chiu; Chih-Ming Huang; Carl Chen
Showing 1 to 8 of 131 publications