Ministry of Education
Tamal Ghosh
VIDWAN ID: 595663

Dr Tamal Ghosh

Male Doctor of Philosophy
Assistant Professor (Grade-II) | School of VLSI Technology
INDIAN INSTITUTE OF ENGINEERING SCIENCE AND TECHNOLOGY, SHIBPUR
West Bengal
Expertise: Nanoscience and Nanotechnology
ORCID 0000-0003-3032-0163 Scopus 57205518921 ResearcherID MBV-9243-2025 Google Scholar dmHf0ckAAAAJ
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26 Publications
0 Projects
381 Scopus Citations
344 CrossRef
7 Years 1 Month Total Experience
Publications
26 Total
Articles
8
Chapters
2
Proceedings
16
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Scopus Scopus
381 Citations
11 h-index
CrossRef CrossRef
344 Citations
10 h-index
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Personal Details

Doctor of Philosophy
2016
Indian Institute of Technology, Madras
Assistant Professor (Grade-II)
Aug 2019 – Present
INDIAN INSTITUTE OF ENGINEERING SCIENCE AND TECHNOLOGY, SHIBPUR | School of VLSI Technology
Engineering and Technology
Nanoscience and Nanotechnology

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Scholarly Work

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Scholarly Publications

Room Temperature Desorption of Self Assembled Monolayer from Copper Surface for Low Temperature & Low Pressure Thermocompression Bonding

Conference Paper
Year: 2015. Pages: 2200-2204 .
Authors: Ghosh, Tamal; Krushnamurthy, E.; Subrahmanyam, Ch.; SivaRamaKrishna, V.; Dutta, A.; Singh, S. G.
DOI 10.1109/ECTC.2015.7159908 Crossref Crossref: 5 Scopus Scopus: 12

Room Temperature Desorption of Self Assembly Monolayer (SAM) Passivated Cu for Lowering the Process Temperature Cu-Cu bonding of 3-D ICs

Conference Paper
Year: 2012. Pages: 1-4 .
Authors: Ghosh, Tarnal; Dutta, Ashudeb; Lingareddy, E.; Subrabmanyam, Ch; Singh, Shiv Govind
DOI 10.1109/ICEMELEC.2012.6636262 Crossref Crossref: 1 Scopus Scopus: 1

Effect of post deposition annealing on thermal evaporated ZnSe:Te towards a scintillator application

Journal Article
Microelectronic Engineering. Year: 2014. Volume: 126 , Pages: 84-87 .
Authors: U. Chatterjee; A. Das; T. Ghosh; S.P. Duttagupta; M.N. Gandhi; S.G. Singh
DOI 10.1016/j.mee.2014.06.016 Crossref Crossref: 4 Scopus Scopus: 4

Low temperature Cu-Cu thermocompression bonding assisted by electrochemical desorption of a self-assembled monolayer

Conference Paper
Year: 2014. Pages: 1-4 .
Authors: Ghosh, T.; Krishna, V.S.R.; Singh, S.G.
DOI 10.1109/ICEmElec.2014.7151165 Crossref Crossref: 1

Stress analysis in 3D IC having Thermal Through Silicon Vias (TTSV)

Conference Paper
Year: 2013. Pages: 2337-2341 .
Authors: Shabaz Basheer Patel; Tamal Ghosh; Asudeb Dutta; Shivgovind Singh
DOI 10.1109/ECTC.2013.6575910 Crossref Crossref: 3 Scopus Scopus: 3

Copper protection by SAM and low temperature bonding for 3dimentional integration

Open Access
Conference Paper
Advanced Materials Research. Year: 2013. Volume: 716 , Pages: 223-227 .
Authors: Tamal Ghosh; Ashudeb Dutta; Shivgovind Singh
DOI 10.4028/www.scientific.net/AMR.716.223 Scopus Scopus: 1

Low temperature, low pressure CMOS compatible Cu -Cu thermo-compression bonding with Ti passivation for 3D IC integration

Conference Paper
Year: 2015. Pages: 2205-2210 .
Authors: Panigrahi, A.K.; Bonam, S.; Ghosh, T.; Vanjari, S.R.K.; Singh, S.G.
DOI 10.1109/ECTC.2015.7159909 Crossref Crossref: 21 Scopus Scopus: 30

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding

Conference Paper
Year: 2015. Pages: TS8.13.1-TS8.13.5 .
Authors: Panigrahi, A.K.; Bonam, S.; Ghosh, T.; Vanjari, S.R.K.; Singh, S.G.
DOI 10.1109/3DIC.2015.7334582 Crossref Crossref: 7 Scopus Scopus: 8
Showing 1 to 8 of 26 publications