Praveen Kumar
VIDWAN ID: 54760

Dr Praveen Kumar

Male Doctor of Philosophy
Professor | Materials Engineering
Indian Institute of Science, Bangalore
Karnataka
Expertise: Materials Science Multidisciplinary
154 Publications
0 Projects
706 Scopus Citations
2115 CrossRef
15 Years 4 Months Total Experience
Publications
154 Total
Articles
130
Books
2
Chapters
4
Proceedings
18
Activity

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Scopus Scopus
706 Citations
16 h-index
CrossRef CrossRef
2,115 Citations
25 h-index
Google Scholar Google Scholar

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Professional Recognition

Young Engineer Award
2017
Indian National Academy of Engineering (INAE)
Professor Priti Shankar Teaching Award
2016
IISc
Young Scientist
2016
Indian National Science Academy (INSA)
Young Scientist Platinum Jubilee Award
2016
National Academy of Science, India (NASI)
Associate
2016
Indian Academy of Science (IAS)
Gandhian Young Technological Innovation Award
2014
President
Dean's Fellowship
2003
University of Southern California
Directors Notional Award
2001
Indian Institute of Technology, Kanpur

Community & Membership

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Indian Science Congress Association
Life Member
Indian Institute of Metals
Life Member
TMS
Member
MRS
Member

Personal Details

Doctor of Philosophy
2007
N/A
Master of Surgery
2005
University of Tübingen
Bachelor of Technology
2003
N/A
Professor
May 2023 – Present
Indian Institute of Science, Bangalore | Materials Engineering
Associate Professor
May 2017 – May 2023
Indian Institute of Science, Bangalore | Materials Engineering
Assistant Professor
May 2011 – Apr 2017
Indian Institute of Science, Bangalore | Materials Engineering
Engineering and Technology
Materials Science Multidisciplinary

Related Profiles

Scholarly Work

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Study and control of electromigration driven material transport for applications in nanofabrication and patterning

University Indian Institute of Science Bangalore
Year 2015
Downloads 0

Tin Whisker Growth from Electrodeposited Sn films: Developing Materials Science and Mechanics Based Insights

University Indian Institute of Science Bangalore
Year 2016
Downloads 0

Synergistic effect of electromagnetic forces on the failure of pre-cracked thin metallic conductors

University Indian Institute of Science Bangalore
Year 2018
Downloads 0

Diffusion–controlled growth of phases in metal–tin systems related to microelectronics packaging

University Indian Institute of Science Bangalore
Year 2018
Downloads 0

Mass Transport in Cu-Interlayer-Si Systems due to Various Types of Thermo-Electro-Mechanical Excursions

University Indian Institute of Science Bangalore
Year 2019
Downloads 0

A WATER BASED ELECTROCHEMICAL LITHOGRAPHY SYSTEM AND METHOD THEREOF

Indian Institute of Science
- Patent No. : IN202041016120A Filed : 14-04-2020
Published : 22-10-2021 Published

A SYSTEM AND METHOD FOR DETERMINATION OF POWER LAW CREEP PARAMETERS FROM A SINGLE BENDING TEST

INDIAN INSTITUTE OF SCIENCE
- Patent No. : IN201941028031A Filed : 12-07-2019
Published : 15-01-2021 Published

A device, system and method generating structures on a substrate by electromigration

S. Talukder
R. Pratap and P. Kumar
- Application No. : 5652/CHE/2013 Filed : 09-12-2013
Published : 30-11--0001 Filed

Scholarly Publications

Influence of strain rate on strength and ductility in an aluminum alloy processed by equal-channel angular pressing

Journal Article
Journal of Materials Science. Year: 2009. Volume: 44 , Issue: 14 , Pages: 3913-3916 .
Authors: Kumar, P.; Xu, C.; Langdon, T.G.

Fracture mechanism map for the fracture of microelectronic Pb-free solder joints under dynamic loading conditions

Conference Paper
Year: 2010. Pages: 298-303 .
Authors: Huang, Z.; Kumar, P.; Dutta, I.; Pang, J.H.L.; Sidhu, R.; Renavikar, M.; Mahajan, R.

Mechanical characteristics of Zn-22% Al and Al-3% Mg alloys processed to high strains by ECAP

Book
Materials Science Forum. Year: 2011. Volume: 667-669 , Pages: 695-700 .
Authors: Kumar, P.; Langdon, T.G.

Development of a microstructurally adaptive unified primary-cum-secondary creep model for SAC387 solder joints

Conference Paper
Year: 2010. Pages: 1-8 .
Authors: Huang, Z.; Kumar, P.; Dutta, I.; Subbarayan, G.; Gupta, V.; Chan, D.; Wen, C.H.

Influence of electric current on diffusionally accommodated sliding at hetero-interfaces

Journal Article
Acta Materialia. Year: 2011. Volume: 59 , Issue: 5 , Pages: 2096-2108 .
Authors: Kumar, P.; Dutta, I.

Interface-related reliability challenges in 3-D interconnect systems with through-silicon vias

Journal Article
JOM: Journal of the Minerals, Metals and Materials Society. Year: 2011. Volume: 63 , Issue: 10 , Pages: 70-77 .
Authors: Dutta, I.; Kumar, P.; Bakir, M.S.

Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications

Journal Article
Journal of Materials Science. Year: 2011. Volume: 46 , Issue: 21 , Pages: 7012-7025 .
Authors: Liu, J.; Kumar, P.; Dutta, I.; Raj, R.; Sidhu, R.; Renavikar, M.; Mahajan, R.

Effect of interfacial layers on the performance of Cu-In liquid phase sintered composites as thermal interface and interconnect materials

Conference Paper
Year: 2011. Pages: 773-780 .
Authors: Liu, J.; Kumar, P.; Dutta, I.; Nagaraj, C.M.; Raj, R.; Renavikar, M.; Mahajan, R.
Showing 33 to 40 of 154 publications