Siva Kumar Malagonda
VIDWAN ID: 320774

Mr Siva Kumar Malagonda

Male Master of Technology
Assistant Professor | Department of Electronics and Communication Engineering
Jawaharlal Nehru Technological University, Anantapur (2013 - 2025)
Andhra Pradesh
Expertise: Telecommunications
12 Publications
0 Projects
23 Scopus Citations
10 CrossRef
12 Years 1 Month Total Experience
Publications
12 Total
Articles
11
Proceedings
1
Activity

No publication activity to display.

Scopus Scopus
23 Citations
3 h-index
CrossRef CrossRef
10 Citations
1 h-index
Google Scholar Google Scholar

Loading Scholar statistics...

Professional Recognition

No Data Found

There is currently nothing to display here.

Community & Membership

No Data Found

There is currently nothing to display here.

No Data Found

There is currently nothing to display here.

Personal Details

Master of Technology
2011
N/A
Assistant Professor
Jul 2013 – Jun 2025
Jawaharlal Nehru Technological University, Anantapur | Department of Electronics and Communication Engineering
Assistant Professor
Jun 2013 – Jun 2013
Jawaharlal Nehru Technological University, Anantapur | Department of Electronics and Communication Engineering
Engineering and Technology
Telecommunications

Related Profiles

Scholarly Work

No Data Found

There is currently nothing to display here.

No Data Found

There is currently nothing to display here.

No Data Found

There is currently nothing to display here.

Scholarly Publications

Enhanced thermal management in 3D integrated circuits coupling

Open Access
Journal Article
International Journal of Informatics and Communication Technology. Year: 2026. Volume: 15 , Issue: 3 , Pages: 1208 .
Authors: Vempalle Rafi; Shaik Hussain Vali; Pradyumna Kumar Dhal; Sadhu Radha Krishna; Murkur Rajesh; Malagonda Siva Kumar

Advancing semiconductor integration: 3D ICs and Perylene-N as superior liner material for minimizing TSV clamour coupling

Open Access
Journal Article
International Journal of Informatics and Communication Technology. Year: 2025. Volume: 14 , Issue: 2 , Pages: 605 .
Authors: Pradyumna Kumar Dhal; Murkur Rajesh; Shaik Hussain Vali; Sadhu Radha Krishna; Malagonda Siva Kumar; Vempalle Rafi

An extensive survey on future direction for the reduction of noise coupling problem in TSV based 3-dimensional IC integration

Conference Paper
Materials Today: Proceedings. Year: 2020. Volume: 46 , Pages: 3502-3511 .
Authors: M. Siva Kumar; J. Mohanraj; N. Vinodh Kumar; M. Valliammai

Enhancement of liner materials based on nanomaterials to promote sustainability in noise intercourse

Open Access
Journal Article
International Journal of Informatics and Communication Technology. Year: 2024. Volume: 13 , Issue: 3 , Pages: 476-483 .
Authors: Malagonda Siva Kumar; Jayavelu Mohanraj

Noise coupling reduction using temperature enhanced device for future integrated circuit integration applications

Open Access
Journal Article
International Journal of Reconfigurable and Embedded Systems (IJRES). Year: 2024. Volume: 13 , Issue: 2 , Pages: 307-314 .
Authors: Malagonda Siva Kumar; Jayavelu Mohanraj

Electrical signal interference minimization using appropriate core material for 3D integrate circuit at high frequency applications

Open Access
Journal Article
International Journal of Electrical and Computer Engineering (IJECE). Year: 2024. Volume: 14 , Issue: 3 , Pages: 2500-2507 .
Authors: Malagonda Siva Kumar; Jayavelu Mohanraj

Modeling and Performance Analysis of TSV using Nanomaterial-Based Dielectric and Core for High Frequency Applications

Journal Article
International Journal of Intelligent Systems and Applications in Engineering. Year: 2023. Volume: 11 , Issue: 3 , Pages: 435-441 .

DESIGN AND CONSTRUCTION OF A SOLAR-POWERED WATER PURIFICATION SYSTEM

Journal Article
Authors: Rosa Orpa Sapulette
Showing 1 to 8 of 12 publications