Aditi
VIDWAN ID: 215928

Dr Aditi

Female Doctor of Philosophy
Senior Scientist | Microsystem Packaging Group
CSIR-CENTRAL BUILDING RESEARCH INSTITUTE (CBRI)
Rajasthan
Expertise: Electrical and Electronic Engineering
15 Publications
0 Projects
92 Scopus Citations
81 CrossRef
6 Years 6 Months Total Experience
Publications
15 Total
Articles
8
Proceedings
7
Activity

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Scopus Scopus
92 Citations
5 h-index
CrossRef CrossRef
81 Citations
5 h-index
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Personal Details

Doctor of Philosophy
2019
N/A
Senior Scientist
Mar 2020 – Present
CSIR-CENTRAL BUILDING RESEARCH INSTITUTE (CBRI) | Microsystem Packaging Group
Engineering and Technology
Electrical and Electronic Engineering

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Scholarly Work

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Scholarly Publications

Design and simulation of MEMS capacitive magnetometer

Conference Paper
AIP Conference Proceedings. Year: 2016. Volume: 1724 .
Authors: Jyoti; Aditi; C. C. Tripathi; Ram Gopal

Design & simulation of in-plane MEMS Lorentz force magnetometer

Conference Paper
AIP Conference Proceedings. Year: 2016. Volume: 1715 .
Authors: Jyoti; Aditi; C. C. Tripathi; Ram Gopal

Fabrication of Capacitive Micromachined Ultrasonic Transducer Arrays with Isolation Trenches Using Anodic Wafer Bonding

Journal Article
IEEE Sensors Journal. Year: 2015. Volume: 15 , Issue: 9 , Pages: 5177-5184 .
Authors: Mukhiya, R.; Aditi; Prabakar, K.; Raghuramaiah, M.; Jayapandian, J.; Gopal, R.; Khanna, V.K.; Shekhar, C.

Investigation of LTCC-based patch antenna for Wireless Applications

Conference Paper
Year: 2022.
Authors: Aditi; Nikhil Suri; Om Ranjan; Dheeraj Kharbanda; Surajit Das; Ayan Bandopadhyay; P. K. Khanna

Investigation of an electroplated NixFey film for magnetometer applications

Journal Article
Indian Journal of Engineering and Materials Sciences. Year: 2025. Volume: 32 , Issue: 3 , Pages: 307-312 .

Design and Modeling of Piezoelectric-AlN-based Acoustic Sensor for Sound Pressure Level Measurements

Journal Article
IETE Technical Review. Year: 2023. Volume: 40 , Issue: 6 , Pages: 783-792 .
Authors: W. R. Ali; Aditi; M. Prasad

Development of MEMS Acoustic Sensor with Microtunnel for High SPL Measurement

Journal Article
IEEE Transactions on Industrial Electronics. Year: 2022. Volume: 69 , Issue: 3 , Pages: 3142-3150 .
Authors: Mahanth Prasad; Aditi; Vinod Kumar Khanna

Wafer Level Fabrication of cMUT using Bonding and Interconnection Technique without TSV/TGV

Conference Paper
Year: 2022. Pages: 199-202 .
Authors: Aditi; Rishabh Agarwal; Rishi Sharma; Luca Maiolo; Antonio Minotti; Francesco Maita; Ravindra Mukhiya
Showing 1 to 8 of 15 publications